Wireless test system

ABSTRACT

One or more testers wirelessly communicate with one or more test stations. The wireless communication may include transmission of test commands and/or test vectors to a test station, resulting in testing of one or more electronic devices at the test station. The wireless communication may also include transmission of test results to a tester. Messages may also be wirelessly exchanged.

BACKGROUND

Although this invention is generally applicable to test systems andmethods in general, it is particularly suited for semiconductor devicetesting.

As known, semiconductor devices are typically manufactured many at atime as “dice” on a semiconductor wafer, after which the dice arefurther processed before being shipped to customers or installed invarious products. That further processing may take many forms.

In perhaps the most common post-manufacture processing, the dice areprobed while still in wafer form and initial testing is performed oneach die. Thereafter, the dice are singulated from the wafer, and thedice that passed the initial probe testing are packaged, burned in, andfurther tested. In another common process, the dice are not packagedafter being singulated from the wafer but are further tested and oftenburned in to produce “known good dice,” which are unpackaged dice thathave been fully tested. In more advanced processes, the dice are burnedin and fully tested while in wafer form. In all of these exemplarypost-manufacture processes, as well as other scenarios in whichelectronic devices of any kind are tested, there is a need to controltesting and/or exercising of the dice or other electronic devices.

BRIEF SUMMARY

The present invention relates generally to test systems and methods. Inan embodiment of the invention, one or more testers wirelesslycommunicate with one or more test stations. The wireless communicationmay include transmission of test commands, test vectors, test results,and/or messages.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 illustrates a block diagram of major elements of an exemplarytest system.

FIG. 2 illustrates an exemplary process that may be run by thecontroller 140 of FIG. 1.

FIG. 3 illustrates an exemplary process that may be run by thecontrollers 160 of FIG. 1.

FIG. 4 illustrates an exemplary detailed implementation of steps 204 and206 of FIG. 2.

FIG. 5 illustrates an exemplary detailed implementation of steps 304 and306 of FIG. 3.

FIG. 6 illustrates a block diagram of major elements of anotherexemplary test system.

FIG. 7 illustrates an exemplary detailed implementation of steps 204 and206 of FIG. 2 run on the controller 140 of Tester I in FIG. 6.

FIG. 8 illustrates an exemplary detailed implementation of steps 204 and206 of FIG. 2 run on the controller 140 of Tester II in FIG. 6.

FIG. 9 illustrates a block diagram of major elements of yet anotherexemplary test system.

FIG. 10 illustrates an exemplary detailed implementation of steps 204and 206 of FIG. 2 run on the controller 140 of Tester I in FIG. 9.

FIG. 11 illustrates an exemplary detailed implementation of steps 204and 206 of FIG. 2 run on the controller 140 of Tester II in FIG. 9.

FIG. 12 illustrates an exemplary detailed implementation of steps 304and 306 of FIG. 2 run on the controllers 160 in FIG. 9.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

The present invention relates generally to test systems and methods.This specification describes exemplary embodiments and applications ofthe invention. The invention, however, is not limited to these exemplaryembodiments and applications or to the manner in which the exemplaryembodiments and applications operate or are described herein.

FIG. 1 illustrates an exemplary test system 100. The system 100 includesa tester 102 and three test stations: test station A 104 a, test stationB 104 b, and test station C 104 c, although more testers and fewer ormore test stations may be used. Tester 102 includes wireless transceiver106, and test stations 104 a-104 c also each include a wirelesstransceiver 110. Optionally, tester 102 may include amicroprocessor-based control system 140. A block diagram of the basiccomponents of an exemplary microprocessor-based control system 140 areshown in FIG. 1, which includes a microprocessor 142, a main memory 148,a program memory 150, a general input/output block 144, and atransceiver input/output block 146. Each test station 104 a-104 c mayinclude a similar microprocessor-based control system 160, with similarelements, including a microprocessor 162, a main memory 168, a programmemory 170, a general input/output block 164, and a transceiverinput/output block 166.

Test station A 104 a, test station B 104 b, and test station C 104 ceach includes one or more electronic devices to be tested. In theexample shown in FIG. 1, all of the test stations 104 a, 104 b, 104 care probers for probing a semiconductor wafer 114 comprising a pluralityof dice 116 a, 116 b, 116 c. Thus, the electronic device to be tested ineach of test stations 104 a-104 c is a wafer 114 or more specificallythe dice 116 a-1 16 c. (Three dice 116 a, 116 b, 116 c per wafer 114 areshown in FIG. 1 for simplicity. Typically, many more dice are fabricatedon a wafer.)

As known, such probers typically include a moveable chuck 120, a probecard 108 having probes 112 for contacting pads 118 on one or more of thedice 116 a, 116 b, 116 c. Test stations 104 a, 104 b, 104 c, however,need not be probers but may be any type of apparatus in which anelectronic device is tested or exercised. Nonlimiting examples includean apparatus comprising sockets, test probes, or load boards for holdingpackaged or unpackaged (singulated) semiconductor dice during testingand/or burn in. Another example is an apparatus for testing multi-chipmodules. (The term “testing,” as used herein, is intended to coverbroadly any form of exercising an electronic device that is part of alarger process of determining the usability, functionality, performance,or reliability of the electronic device. Thus, for example, the term“testing” includes exercising a semiconductor device during burn inregardless of whether the device is monitored or analyzed during theexercising.) Tester 102 controls testing of the electronic devices 114.

Transceivers 106 and 110 allow the tester 102 and the test stations 104a-104 c to communicate wirelessly. Thus, although tester 102 and teststations 104 a-104 c may be located near each other, each may be locatedremotely from the others. Element 122 in FIG. 1 represents an optionalphysical separation between the tester 102 and the test stations 104a-104 c. Thus, tester 102, on one hand, and test stations 104 a-104 c,on the other hand, may be located in different rooms, differentbuildings, or even different geographical locations. The wireless linkbetween the tester 102 and each of the test stations 104 a-104 c may beany type of wireless link, including without limitation any type ofoptical or radio signal link and may include such intermediate elementsas repeaters and/or communication satellites. Indeed, the tester 102 andits transceiver 106 may be remotely located one from another with acommunication network, such as a local area network, wide area network,or metropolitan area network or the Internet, between them. Although notshown in FIG. 1, test stations 104 a-104 c may also be physicallyseparated or located remotely one from another.

FIG. 2 illustrates basic operation of the tester 102, and FIG. 3illustrates basic operation of a test station 104. (Reference to “104”without specifying “a,” “b,” or “c” refers to any one or more of thetest stations.) At step 202, the tester 102 is initialized, and at step302 a test station is initialized. At step 204, the tester 102 sendswirelessly test data to a test station 104, and at step 304, the teststation 104 tests an electronic device 114 in accordance with the testdata. At step 306, the test station 104 transmits wirelessly results ofthe testing to the tester 102, which is received by the tester at step206.

As one option, the processes shown in FIG. 2 may be implemented in thetester 102 as software (including firmware or microcode) stored inprogram memory 150 and executed by microprocessor 142. Similarly, theprocess illustrated in FIG. 3 may be implemented in a test station 104as software stored in program memory 170 and executed by microprocessor162. In the tester 102, data to be transmitted by the transceiver 106and data received via the transceiver 106 may be output or input throughthe transceiver input/output block 146. Other data may be input oroutput through the general input/output block 144. The generalinput/output block 164 and the transceiver input/output block 166 in atest station's microprocessor-based controller 160 may be generallysimilar to like elements in the tester's controller 140.

The test data sent by the tester 102 to a test station 104 may be in anyformat recognizable by the test station. As one example, the test datamay be test vectors that include both the data to be written to theelectronic device under test 114 and an identification of the probesthrough which the test data is to be written. In such case, the teststation 104 simply places data on the probes as specified by the testvectors. As another example of a format for the test data, the test datamay comprise commands that cause a test station 104 to generate testvectors for testing a die 116 a-116 c. The results data transmitted by atest station 104 back to the tester 102 may likewise be in any formatrecognizable by the tester 102, which may range from raw data generatedby the die 116 a-116 c to data representing an analysis or summary ofthe response of the die 116 a-116 c to the test data.

FIG. 4 illustrates an exemplary detailed implementation of steps 204 and206 from FIG. 2, and FIG. 5 illustrates a corresponding implementationof steps 304 and 306 from FIG. 3. The exemplary processes of FIGS. 4 and5 will be discussed with respect to the test system 100 shown in FIG. 1.As will be seen, the process of FIG. 4 causes the tester 102 to initiatetesting at the test stations 104 a-104 c, after which the tester 102waits for messages from the test stations 104 a-104 c indicating thattesting is completed. Upon receiving such a message, the tester 102requests transfer of the test results data.

For purposes of illustration, it will be assumed that test station A 104a and test station B 104 b are initialized at step 302 of FIG. 3. Thisinitialization may include such things as loading wafers 114 to betested into test station A 104 a and test station B 104 b.Initialization may also include loading data into the main memory 168 ofthe microprocessor-based control system 160 in each of test station A104 a and test station B 104 b. If the test data to be received from thetester 102 comprise test commands, a command table for decoding thecommands may also be loaded into the main memory 168 of each of the teststations 104 a and 104 b. To complete initialization, each test station104 a and 104 b sends a request to the tester 102 to be brought on linefor testing. The request may include data both identifying the teststation and the type of wafer loaded into the test station.

In the mean time, the tester 102 is also initialized at step 202 of FIG.2. Initialization of the tester 102 may include such things as loading alist of wafer types and tests to be run on each wafer type into the mainmemory 148 of the microprocessor-based control system 140 in the tester102. As mentioned above, in this example, it is assumed that the testsequences are defined by one or a series of test commands. To completeinitialization, the tester 102 brings all test stations 104 from which amessage requesting to be brought on line has been received. This may bedone, for example, by creating a list of the test stations to be broughton line and the wafer type in each test station, and storing the list inthe main memory 148 of the controller 140 in the tester 102.

After initialization of both the tester 102 and test station A 104 a andtest station B 104 b, the tester 102 is ready to begin executing theprocess illustrated in FIG. 4, and each on-line test station—teststation A 104 a and test station B 104 b—is ready to begin executing theprocess shown in FIG. 5. (Note that in this example, test station C 104c was not initialized and brought on line for testing.)

As shown in FIG. 4, the tester 102 selects a test station at step 402.The selected test station may be any of the on-line test stations aslisted in the tester's main memory 148. In this example, there are twotest stations—test station A 104 a and test station B 104 b—listed ason-line in the tester's main memory 148, and the tester 102 selects teststation A 104 a at step 402. At step 404, the tester 102 initiatestesting of the wafer 114 in the selected test station 104 a. Asmentioned above, in this example, the tester 102 does so by transmittingwirelessly to the selected test station—test station A 104 a—a testcommand or a series of test commands. To do so, the tester 102 looks inits main memory 148 at the type of wafer in the selected test station104 a, and then retrieves, also from its main memory 148, the testcommand or series of test commands for that wafer type. The test commandor commands define the test(s) to be performed on the dice of that wafertype. Step 404 may also include setting a flag in the tester's mainmemory 148 indicating that testing is underway in the selected tester104 a.

After initiating testing at the selected test station 104 a at step 404,the tester 102 determines at step 406 whether it has received anymessages. If not, the tester selects another of the on-line testers atstep 408. The tester 102 may do so by searching the list of on-line teststations in the tester's main memory 148 for a test station wheretesting is neither underway nor completed. In this example, the tester102 selects test station B 104 b at step 408 and then repeats step 404,initiating testing in the newly selected test station B 104 b bywirelessly transmitting a test command or series of test commands, asdescribed above. In this example, there are only two test stations online—test station A 104 a, and test station B 104 b. In other examplesinvolving more on-line test stations, this process would continue to berepeated.

During this process, if a message is received, execution branches at 406so that the message is decoded and any necessary action taken. If themessage is from a test station 116 a-116 c indicating that testing atthat test station 104 has completed (see step 410), then the tester 102processes the results of the testing at step 412. Processing the testresults (step 412) may include such things as sending a message to thetest station requesting transmission of the test results.(Alternatively, if the test results were transmitted with the messagefrom the test station, the tester 102 reads the test results from aninternal buffer (not shown).) Step 412 may also include additionalactions, such as setting a flag in the tester's main memory 148indicating that testing has completed at that test station. If, as shownin FIG. 1, the test station contacts less than all of the dice 116 a-116c on the wafer 114 being tested, step 412 may include causing the teststation to reposition the wafer 114 to contact an as yet untested die ordice. After processing the test results at step 412, the process of FIG.4 repeats step 408 of selecting a new test station, from which theprocess beginning with step 404 is repeated as necessary to initiatetesting at the test stations.

If the message detected at step 406 was a request from a new teststation to be brought on line or a request from an on-line test stationto be taken off line (see step 414), then the new test station isbrought on line at step 416 or the on-line test station is brought offline at step 416. Bringing a new test station on line may include suchthings as adding the new test station's identifier and wafer type to thelist of on-line test stations stored in the tester's main memory 148.Likewise, taking an on-line test station off line may include suchthings as deleting the test station's identifier and wafer type from thesame list.

In the example being discussed, only test station A 104 a and teststation B 104 b were brought on line. While testing is occurring atthose two test stations 104 a, 104 b, an operator may initialize teststation C 104 c by, among other things, loading a wafer 114 into teststation C 104 c. Test station C 104 c may then send a request to thetester 102 to be brought on line. As discussed above, the tester 102will then bring test station C 104 c on line at step 416 of FIG. 4. Onceon line, test station C 104 c will eventually be selected at step 408and tests initiated at step 404.

As mentioned above, FIG. 5 illustrates operation of each of the teststations 104 in response to messages sent by the tester 102 duringoperation of the process shown in FIG. 4. As also mentioned above, FIG.5 illustrates an exemplary detailed implementation of steps 304 and 306of FIG. 3 and is therefore executed after the initialization step 302 ofFIG. 3. As shown in FIG. 5, each on-line test station 104 waits for amessage at step 501. If a message containing a test command is receivedfrom the tester 102 (see steps 506, 510), then the test command isexecuted at step 512. The test command may be executed, for example, byfinding the test command in a decode table stored in the test station'smain memory 168 and taking the actions indicating in the decode tablefor the test command. As just one example, the decode table may containa test vector or vectors that are to be written to the wafer 114. Asanother example, the test station 104 may generate commands that aresent to the dice 116 a-116 c and executed by self test circuitry on thedice (e.g., so called built-in-self-test circuitry). Execution of thetest command may also include buffering the response data generated bythe die being tested and sending a message to the tester 102 thattesting is completed and response data is ready. If the message was arequest from the tester 102 to send test results for testing that hascompleted (see step 514), then the test results (which may be bufferedat the test station 104) are transmitted wirelessly to the tester atstep 516. Alternatively, the test results may be stored and/or analyzedsolely at the test station, and the results may be retrieved by otherthan the tester 102—e.g., an operator—from the test station 104.

Step 418 in FIG. 4 and step 518 in FIG. 5 illustrate other miscellaneousactions that may be taken by the tester 102 or a test station 104. Suchother actions may include ending the process, handling errors, etc. Inaddition, provisions may be made in each process for processing multiplemessages. These and other modifications and additions to the processesshown in FIGS. 4 and 5 are within the skill of the ordinary practitionerin the field and need not be discussed.

FIG. 6 illustrates another exemplary test system 600. As shown, testsystem 600 also includes three test stations: test station A 604 a, teststation B 104 b, and test station C 104 c, although fewer or more couldbe used. In this example, each test station 604 a-604 c includes a loadboard 608 with sockets 612 for receiving singulated dice 616 a, 616 b.Each load board also includes a transceiver 610 and internal wiring (notshown) for carrying test signals and response data to and from the dice616 a, 616 b. Each test station 604 a-604 c also includes a controller160, which may be generally similar to controller 160 discussed abovewith respect to FIG. 1.

Test system 600 also includes two testers: tester I 602 a and tester II602 b. Again, however, fewer or more testers may be used. Each tester602 includes a transceiver 606 and a controller 140, which may also begenerally similar to controller 140 discussed above with respect toFIG. 1. A communication link 626 interconnects tester I 602 a and testerII 602 b and also connects to storage unit 624. Communication link 626may be any type of electronic communication device, including withoutlimitation a cable, a wireless link, a computer network, etc. Like 122in FIG. 1, element 622 represents optional physical separation.

In this example, tester I 602 a causes a first functional test (test 1)to be performed on the dice 616 a, 616 b, and tester II 602 b causes asecond functional test (test 2) to be performed on the same dice. Thus,full testing of the dice 616 a, 616 b, in this example, includes bothtest 1 and test 2. For example, test 1 may be a fast functional test,and test 2 may be a longer, more exacting functional test. More than twosequential tests may be run on the dice 116 a, 116 b, and such testscould include exercise during burn in.

The processes shown in FIGS. 2 and 3 may also be run on the testers 602a, 602 b and test stations 604 a-604 c of FIG. 6. That is, the processshown in FIG. 2 may be run on each of the testers 602 a, 602 b, and theprocess shown in FIG. 3 may be run on each of the test stations 604a-604 c.

FIGS. 7 and 8 illustrate an exemplary detailed implementation of steps204 and 206 from FIG. 2 that may be run on tester I 602 a and tester II602 b, respectively. The process of FIG. 5, discussed above, may beimplemented on each of the test stations 604 a-604 c. As will be seen,in the process of FIG. 7, tester I 602 a initiates a first test (test 1)at the test stations 604 a-604 c, after which tester I 602 a waits for amessage from each test station indicating that test 1 has completed atthat test station. Upon receiving such a message from a particular teststation, tester I 602 a requests transfer of the results of test 1 fromthat particular test station, and tester I 602 a sends a message totester II 602 b indicating that test 1 has completed at that teststation. Upon receiving this message from tester I 602 a, tester II 602b initiates test 2 at that particular test station, and then waits for amessage from that test station that test 2 has been completed, afterwhich tester 2 602 b requests the results of test 2 from the teststation. Both testers 602 a, 602 b may store the results of the tests inthe storage device 624.

For purposes of illustration, it will be assumed that test station A 604a, test station B 604 b, and test station C 604 c are all initialized atstep 302 of FIG. 3. This initialization may be generally similar to theinitialization of test station A 104 a and test station B 104 b of FIG.1 as described above with respect to FIGS. 3-5. For example,initialization of test station A 604 a, test station B, 604 b, and teststation C 604 c may include such things as securing dice to be tested616 a, 616 b to load boards 608, and placing a load board in each teststation. Initialization data may also be loaded into the main memory 168of the microprocessor-based control system 160 in each test station 604a-604 c. If the test data to be received from the testers 602 a, 602 bcomprise commands, a command table for decoding the commands may also beloaded into the main memory 168 of each of the test stations 604 a-604c. To complete initialization, each test station 604 a-604 c sends arequest to tester I 602 a to be brought on line for testing. The requestmay include data both identifying the test station and the type of diceto be tested at the test station.

In the mean time, tester I 602 a and tester II 602 b are alsoinitialized at step 202 of FIG. 2. Initialization of the testers 602 a,602 b may also be similar to the initialization of tester 102 describedabove with respect to FIGS. 2, 4, and 5. For example, initialization ineach tester 602 a, 602 b may include such things as loading a list ofdice types and test sequences to be run on each dice type into the mainmemory 148 of the microprocessor-based control system 140 in each tester602 a, 602 b. As mentioned above, in this example, it is assumed thatthe test sequences are defined by one or a series of test commands. Tocomplete initialization, tester I 602 a brings on line all test stationsfrom which a message requesting to be brought on line has been received.This may be done, for example, by creating a list of the test stationsto be brought on line and the dice type in each test station, andstoring the list in the main memory 148 of the microprocessor-basedcontrol system 140 in tester I 602 a.

After initialization of the testers 602 a, 602 b and the test stations604 a-604 c, tester I 602 a is ready to begin executing the processillustrated in FIG. 7; tester II 602 b is ready to begin executing theprocess illustrated in FIG. 8; and each on-line test station—teststation A 604 a, test station B, 604 b, and test station C 604 c—isready to begin executing the process shown in FIG. 5.

As shown in FIG. 7, tester I 602 a selects a test station at step 702.The selected test station may be any of the on-line test stations listedin the main memory 148 of tester I 602 a. For illustration purposes inthis example, there are three test stations—test station A 604 a, teststation B 604 b, and test station C 604c—listed as on-line in the mainmemory 168 of tester I 602 a, and tester I 602 a selects test station A604 a at step 702. At step 704, tester I 702 initiates test 1 on thedice 616 a, 616 b at the selected test station-test station A 604 a. Asmentioned above, in this example, tester I 602 a does so by transmittingwirelessly the selected test station 604 a one or a series of testcommands that define test 1. Step 704 may also include setting a flag inthe main memory 148 of Tester I 602 a indicating that testing isunderway at the selected test station-test station A 604 a.

After initiating test 1 at the selected test station—test station A 604a—at step 704, tester I 602 a determines at step 706 whether it hasreceived any messages. If not, tester I 602 a selects another of theon-line testers at step 708, which may be accomplished generally asdescribed above with respect to FIG. 4. In this example, tester I 602 aselects test station B 604 b at step 708 and then repeats step 704,initiating test 1 on the dice 616 a, 616 b in the newly selected teststation, which is now test station B 604 b.

In this example, it is assumed that test station A 604 a completes test1 and sends a message indicating as much to tester I 602 a shortly aftertester I 602 a initiates test 1 at test station B 604 b. Thus, at thenext pass through the process of FIG. 7, a message is detected at step706, causing the process of FIG. 7 to branch to step 710. Because themessage indicates that test 1 has completed at test station A 602 a, theprocess of FIG. 7 branches to step 712, where tester I 602 a processesthe results of test 1 in test station 602 a. Processing the results oftest 1 (step 712) may include such things as sending a message to thetest station requesting transmission of the results of test 1.(Alternatively, if the test results were transmitted with the messagefrom the test station, tester I 602 a reads the test results from aninternal buffer (not shown).) Step 712 may also include additionalactions, such as setting a flag in the main memory 148 of tester I 602 aindicating that test 1 has been completed at that test station.

After processing at step 712 the test results of test 1 executed at teststation A 604 a, the process of FIG. 7 sends a message to tester II 602b indicating that test 1 has completed at test station A (see step 713).As will be seen, this causes tester II 602 b to initiate test 2 at teststation A 604 a. Thereafter, tester I 602 a repeats step 708 and selectsthis time test station C 604 c and repeats the process shown in FIG. 7at step 704, initiating test 1 at test station C 604 c.

Referring now to FIG. 8, which illustrates exemplary operation of testerII 602 b, after initialization at step 202 of FIG. 2 (as discussedabove), tester II 602 b waits for a message at step 801. Upon receivingthe message from tester I 602 a that test 1 has completed at teststation A 604 a (see step 713 of FIG. 7, as discussed above), tester II602 b takes the “yes” branches at steps 806 and 807 of FIG. 8. At step809, tester II 602 b initiates test 2 at test station A 604 a. Tester II602 b does so by wirelessly sending to test station A 604A a command orseries of commands that define test 2. As test 1 finishes in each of theremaining test stations B 604 b and C 604 c, tester I 602 a processesthe results of test 1 at those test stations at step 712 of FIG. 7 andsends a message at step 713 of FIG. 7 to tester II 602 b, indicatingthat test 1 has completed at each of those test stations. Tester II 602b then initiates test 2 in each of those test stations, per steps 806,807, 809 of FIG. 8. As test 2 completes at each of the test stations 604a-604 c, each test station sends a message to tester II 604 b. Inresponse to each such message, tester II 604 b processes the results oftest 2 at that particular test station, per steps 806, 810, 812 of FIG.8. The step of processing test results at step 812 may be generallysimilar to step 412 of FIG. 4 and step 712 of FIG. 7.

During these processes, a new test station may send a message to testerI 602 a requesting to be brought on line. Likewise, an on-line teststation may send a message to tester I 602 a requesting to be takenoffice line. Such requests are processed by tester I 602 a at steps 714,716 of FIG. 7, and may be accomplished in a manner generally similar tostep 416 of FIG. 4 as described above. As just one example, when test 2completes in test station A 602 a, an operator may cause test station A602 a to be taken off line, replace the now fully tested dice 116 a, 116b with new dice to be tested, and cause test station A 602 a to bebrought back on line, now as a new test station with dice to be tested.This may be accomplished by causing test station A 604 a to send testerI 602 a a message requesting to be taken off line, and then afterloading a new wafer 114 to be tested into test station A 604 a, causingtest station A to send tester I 602 a a message requesting to be broughton line.

It should be apparent that testers may also be brought on and off line.By strategically bringing testers and test stations on and off line asneeded, a test system may be balanced for maximum data through putbetween tester and test stations and maximum testing efficiency.

Step 718 in FIG. 7 and step 818 in FIG. 8 illustrate other miscellaneousactions that may be taken by tester I 602 a and tester II 602 b, whichmay be generally similar to miscellaneous actions described above withrespect to FIGS. 4 and 5.

FIG. 9 illustrates another exemplary test system 900. Test system 900also includes three test stations: test station A 904 a, test station B904 b, and test station C 904 c, although fewer or more may be used. Inthis example, each test station 904 a-904 c is a prober for probing anunsingulated semiconductor wafer 914 comprising a plurality of dice 916a-916 d. (Again, four dice 916 a-916 d are shown for ease ofillustration, but more or fewer may be present.) Such probers may besimilar to the probers discussed above with respect to FIG. 1 and mayinclude such things as a probe card 908 with probes 912 for contactingpads 918 on wafer 914 and a chuck 920 for holding and moving wafer 914.Each test station 904 a-904 c also includes a transceiver 910 and acontroller 160, which may be generally similar to transceiver 910 and acontroller 160 as in FIG. 1.

Test system 900 also includes two testers: tester I 902 a and tester II902 b. Each tester includes a transceiver 906 and a controller 140,which may also be generally similar to controller 140 discussed abovewith respect to FIG. 1. Similar to FIG. 6, a communication link 926interconnects tester I 902 a and tester II 902 b and also connects tostorage unit 924. As discussed above with respect to FIG. 6,communication link 926 may be any type of electronic communication link.Like element 122 in FIG. 1 and element 622 in FIG. 6 (both discussedabove), element 922 represents an optional physical separation. In thisexample, probe card 908 is capable of contacting two dice at one time.Probe card 908 is shown in FIG. 9 contacting dice 916 a, 916 b. Often aprobe card will contact more than two dice, but two dice are shown inFIG. 9 for ease of illustration.

In this example, rather than send test data in the form of testcommands, Tester I 902 a and Tester II 902 b send test vectors to teststations 904 a-904 c. For purposes of this example, it is assume thatneither tester 902 a, 902 b has sufficient bandwidth to send enough testvectors to test both die 916 a and die 916 b at the same time. As willbe seen, Tester I and Tester II both send the same test vectors to aparticular test station 904. The test station 904 uses test vectors fromone tester to test one of the dice and test vectors from the othertester to test the other die.

The general process shown in FIG. 2 may also be run on the I 902 a andtester II 902 b of the test system 900 shown in FIG. 9, and the generalprocess shown in FIG. 3 may be run on test station A 904 a, test stationB 904 b, and test station C 904 c.

FIG. 10 illustrates an exemplary detailed implementation of steps 204and 206 from FIG. 2 that may be run in tester I 902 a, and FIG. 11illustrates an exemplary detailed implementation of steps 204 and 206from FIG. 2 that may be run in tester II 902 b. FIG. 12 illustrates anexemplary detailed implementation of steps 304 and 306 from FIG. 3 thatmay be run in each of test station A 904 a, test station B 904 b, andtest station C 904 c. As will be seen, in the processes of FIGS. 10 and11, tester I 902 a selects a test station having a wafer in need oftesting and sends a message to tester II 902 b. Tester I 902 a theninitiates testing of die 1 916 a at the selected test station, andtester II 902 b initiates testing of die 2 916 b at the selected tester.Tester I 902 a then continues to select test stations with wafers inneed of testing, after which both testers continue to initiate testingof the dice at the selected test stations. As the various tests arecompleted, both testers collect the test results and store the resultsin the storage device 924. The testers 902 a, 902 b communication withthe test stations 904 a, 904 b, 904 c wirelessly.

Again, for purposes of illustration, it will be assumed that teststation A 904 a, test station B 904 b, and test station C 904 c areinitialized at step 302 of FIG. 3. This initialization may be generallysimilar to the initialization of test stations 104 a and 104 b describedabove with respect to FIGS. 3-5. To complete initialization, each oftest station A 904 a, test station B 904 b, and test station C 904 csends a request to tester I 902 a to be brought on line for testing. Therequest may include data both identifying the test station and the typeof wafer loaded into the test station.

In the mean time, tester I 902 a and tester II 902 b are alsoinitialized at step 202 of FIG. 2. Initialization of the testers 902 a,902 b may also be similar to the initialization of tester 102 describedabove with respect to FIGS. 2, 4, and 5. To complete initialization,tester I 902 a brings on line all test stations from which a messagerequesting to be brought on line has been received. This may be done,for example, by creating a list of the test stations to be brought online and the wafer type in each test station, and storing the list inthe main memory 148 of the microprocessor-based control system 140 oftester I 902 a.

After initialization of the testers 902 a, 902 b and the test stations904 a-904 c, tester I 902 a is ready to begin executing the processillustrated in FIG. 10; tester II 902 b is ready to begin executing theprocess illustrated in FIG. 11; and each on-line test station 904 a-904c is read to begin executing the process shown in FIG. 12.

As shown in FIG. 10, tester I 902 a selects a test station at step 1002.The selected test station may be any of the on-line test stations aslisted in the main memory 148 of tester I 902 a. For purposes of thisexample, all three of the test stations—test station A 904 a, teststation B 904 b, and test station C 904 c—are listed as on-line in themain memory 148 of tester I 902 a, and tester I 902 a selects teststation A 904 a at step 1002. At step 1003, tester I 902 a sends amessage to tester II 902 b that test station A 904 a is selected.Thereafter, at step 1004, tester I 902 a initiates testing on the firstdie 916 a of wafer 914 in test station A 904 a. In this example, testerI 902 a does so by transmitting wirelessly one or more test vectors totest station A 904 a. Step 1004 may also include setting a flag in themain memory 148 of tester I 902 a indicating that testing is underway atthe selected test station—test station A 904 a.

After initiating testing of die 1 916 a of wafer 914 at the selectedtest station 904 a at step 1004, tester I 902 a determines at step 1006whether it has received any messages. If not, tester I 902 a selectsanother of the on-line testers at step 1008, which may be accomplishedgenerally as described above with respect to FIG. 4. In this example,tester I 902 a selects test station B 904 b at step 1008. Tester I 902 athen repeats the process of FIG. 10 beginning at step 1003. That is,tester I 902 a sends a message to tester II 902 b that test station B904 b is now selected, and tester I 902 a initiates testing of die 1 916a of wafer 914 at the new selected test station—test station B 904 b. Asthis process continues, tester I 902 a initiates testing of die I 916 aof all of the wafers 914 in each of the on-line test stations 904, andtester I 902 a sends a message to tester II 902 b each time one of thetest stations is selected.

Referring now to FIG. 11, after initialization, tester II 902 b waitsfor messages at step 1101. In response to a message sent by tester I 902a at step 1003 of FIG. 10 identifying a selected test station, tester II902 b initiates testing of die 2 916 b of the wafer 914 at the selectedtest station at step 1109. Like tester I 902 a, in this example, testerII 902 b initiates testing of die 2 916 b by wirelessly transmitting oneor more test vectors to the selected test station.

As should be apparent, the operation of the process of FIG. 10 in testerI 902 a and the process of FIG. 11 in tester II 902 b results in theroughly simultaneous initiation of testing of die 1 916 a (by tester I902 a) and die 2 916 b (by tester II 902 b) of the wafer 914 at theselected test station.

Referring now to FIG. 12, after initialization, each test station 904a-904 c waits for messages at step 1201. Upon receiving test vectorsfrom one of the testers 902 (sent by tester I 902 a at step 1004 of FIG.10 or tester II 902 b at step 1109 of FIG. 11), the test station 904writes the test vectors through the probes 912 of probe card 908 (seesteps 1206, 1210, 1212). If the test vectors were received from tester I902 a, the test station 904 writes the test vectors to die 1 916 a; ifthe tester vectors were received from tester II 902 b, the test station904 writes the test vectors to die 2 916 b. Preferably, the test vectorsinclude both test data and an identification of the probes 912 throughwhich the test data is to be written. The test station 904 then collectsresponse data produced by the dice in response to the test vectors andbuffers the response data at step 1211. The test station 904 then sendsa message at step 1213 to the tester 902 from which the test vectorswere received indicating that the tests are completed.

Referring again to FIG. 10, tester I 902 a, upon receiving a messagefrom a test station 904 indicating that testing has completed (see steps1006, 1010), processes the results of the testing at step 1012, whichmay include such things as sending a message to the test station 904requesting transmission of the test results. In this example, wafer 914must be moved after testing dice 916 a, 916 b to contact and test dice916 c, 916 d. At step 1017, if tester I 902 a has received an indicationfrom tester II 902 b that testing of die 2 916 b has been completed,tester I 902 a causes the test station 904 to move the wafer 914 tocontact and test dice 916 c, 916 d.

Referring now to FIG. 11, tester II 902 b, upon receiving a message froma test station 904 indicating that the testing has completed (see steps1106, 1110), tester II 902 b processes the results of the testing atstep 1112, which may include such things as sending a message to thetest station requesting transmission of the test results. At step 1113,tester II 902 b sends a message to tester I 902 a that testing of die 2916 b has been completed. Referring now to FIG. 10, upon receiving sucha message from tester II 902 b, tester I 902 a causes the test station904 to move the wafer 914 to contact and test dice 916 c, 916 d iftesting of die 1 916 a has been completed. (See steps 1007, 1015.)

Referring again to FIG. 12, a test station 904 that receives a messagefrom one of the testers 902 a, 902 b requesting the results of testingsends the test results to the tester 902 at step 1216 (see also steps1206, 1214). Element 1218, labeled “other,” in FIG. 12 represents othertasks that might be performed by a test station 904. Moving the wafer inresponse to a command from tester I 902 a (as discussed above) is anexample of such a task. A message originating from any number ofpossible sources stopping the process of FIG. 12 is another example.Stopping the process and other miscellaneous tasks may be performed atstep 1018 in FIG. 10 and 1118 in FIG. 11.

As with other processes described above, a new test station may send amessages to tester I 902 a requesting to be brought on line. Likewise,an on-line test station may send a message to tester I 902 a requestingto be taken office line. Such requests are processed by tester I 902 aat steps 1014, 1016 of FIG. 10, and may be accomplished in a mannergenerally similar to step 416 of FIG. 4 as described above.

As mentioned previously, the processes illustrated in FIGS. 2-5, 7, 8,and 10-12 are exemplary only and not to be taken as limiting. Similarly,the systems shown in FIGS. 1, 6, and 9 are exemplary only and not to betaken as limiting.

It should be apparent that, in all of the processes illustrated in FIGS.4, 6, and 10, provisions may be made for by passing steps 408, 608, and1008 if no new test stations are available. Such provisions are,however, well within the skill of a person of ordinary skill in thefield and need not be discussed. Similarly, provisions for processingerror conditions, exiting the processes illustrated in FIGS. 2-5, 7, 8,and 10-12, or processing multiple messages are well within the skill ofa person of ordinary skill in the field and also need not be discussed.

Note that probe cards, such as probe card 108 in FIG. 1 and probe card908 in FIG. 9, are often capable of contacting many more than one die ata time. Thus, die 116 b in FIG. 1 may represent a plurality of dicebeing contacted by probe card 108. Likewise, each of dice 916 a and 916b in FIG. 9 may represent a plurality of dice being contacted by probecard 908.

Although specific embodiments and applications of the invention havebeen described in this specification, there is no intention that theinvention be limited to these exemplary embodiments and applications orto the manner in which the exemplary embodiments and applicationsoperate or are described herein.

1. A method of testing in a system comprising a tester and a teststation, said method comprising. transmitting test data wirelessly fromsaid tester to said test station; and testing an electronic device atsaid test station in accordance with said transmitted test data.
 2. Themethod of claim 1 further comprising: transmitting results of saidtesting wirelessly from said test station to said tester.
 3. The methodof claim 1, wherein said step of testing further comprises testing aplurality of electronic devices at said test station using saidtransmitted test data.
 4. The method of claim 1, wherein said test datacomprises commands and said step of testing an electronic devicecomprises executing said commands.
 5. The method of claim 4, whereinsaid electronic device comprises self-test circuitry and said step ofexecuting commands comprises operation of said self-test circuitry. 6.The method of claim 1, wherein said test system further comprises aplurality of test stations, and said step of transmitting test datacomprises transmitting test data to a plurality of test stations.
 7. Themethod of claim 6, wherein test data transmitted to each of said teststations is the same.
 8. The method of claim 6, wherein test datatransmitted to at least one of said test stations is different than testdata transmitted to another of said test stations.
 9. The method ofclaim 6, wherein said step of testing comprises testing at each of saidtest stations an electronics device at said test station using test datatransmitted to said test station.
 10. The method of claim 9 furthercomprising transmitting from each of said test stations results oftesting said electronic device at said work station.
 11. The method ofclaim 1 further comprising adding another test station to said testsystem.
 12. The method of claim 11, wherein said step of adding anothertest station comprises said other test station transmitting wirelesslyto said tester a request to be added to said test system.
 13. The methodof claim 1, wherein: said test system comprises a plurality of testers,said step of transmitting test data comprises a first tester of saidplurality of testers transmitting first test data to said test station;said step of testing an electronic device comprises performing a firsttest on said electronic device in accordance with said first test data;said method further comprising transmitting second test data wirelesslyfrom a second tester of said plurality of testers to said test station;and performing a second test on said electronic device at said teststation in accordance with said second test data.
 14. The method ofclaim 13, wherein said first test and said second test are differenttests.
 15. The method of claim 13, wherein a plurality of saidelectronic devices are disposed at said test station, and said firsttest is performed on a first subset of said plurality of electronicdevices, and said second test is performed on a second subset of saidplurality of electronic devices.
 16. The method of claim 1, wherein saidtest station comprises a prober and said electronic device comprises asemiconductor wafer.
 17. The method of claim 1, wherein said electronicdevice comprises a packaged semiconductor die.
 18. The method of claim1, wherein said electronic device comprises a singulated, unpackagedsemiconductor die.
 19. The method of claim 1, wherein said electronicdevice comprises a multi-chip module.
 20. A tester comprising:initiating means for wirelessly initiating testing of an electronicdevice at a test station; and receiving means for wirelessly receivingresults of said testing from said test station.
 21. The tester of claim20, wherein said initiating means further comprises means for initiatingtesting of a plurality of electronic devices at said test station. 22.The tester of claim 20, wherein: said initiating means further comprisesmeans for initiating testing of an electronic device at each of aplurality of test stations; and said receiving means further comprisesmeans for receiving results of said testing from each of said teststations.
 23. The tester of claim 20 further comprising means formaintaining an identification of a plurality of test stations, wherein:said initiating means further comprises means for initiating testing ofan electronic device at each of said plurality of test stations; andsaid receiving means further comprises means for receiving results ofsaid testing from each of said plurality of test stations.
 24. Thetester of claim 23 further comprising adding means for adding anadditional test station to said plurality of test stations.
 25. Thetester of claim 24, wherein said adding means adds said additional teststation after said initiating means initiates testing of an electronicdevice at at least one of said plurality of test stations but beforesaid receiving means receives results of said testing of said electronicdevice at said at least one of said plurality of test stations.
 26. Thetester of claim 24 further comprising means for removing one of saidtest stations from said plurality of test stations.
 27. The tester ofclaim 20 further comprising means for signaling another tester thatresults of testing have been received from said test station.
 28. Thetester of claim 20 further comprising means for receiving a signal fromanother tester that testing of said electronic device by said othertester is completed, wherein said initiating means initiates saidtesting in response to said signal from said other tester.
 29. Thetester of claim 20, wherein said test station comprises a prober andsaid electronic device comprises an unsingulated semiconductor wafer.30. The tester of claim 20, wherein said electronic device comprises apackaged semiconductor die.
 31. The tester of claim 20, wherein saidelectronic device comprises a singulated, unpackaged semiconductor die.32. The tester of claim 20, wherein said electronic device comprises amulti-chip module.
 33. A test station comprising: an electronic deviceto be tested; receiving means for wirelessly receiving test data from atester; and testing means for testing said electronic device inaccordance with said test data.
 34. The test station of claim 33 furthercomprising means for wirelessly transmitting results of said testing tosaid tester.
 35. The test station of 33, wherein said receiving meansfurther comprises means for receiving test data from a plurality oftesters.
 36. The test station of claim 35, wherein said testing meanscomprises: means for testing said electronic device in accordance withfirst test data received from a first tester of said plurality oftesters; and means for testing said electronic device in accordance withsecond test data received from a second tester of said plurality oftesters.
 37. The test station of claim 36,further comprisingtransmitting means for wirelessly transmitting to said first testerresults of said testing in accordance with said first test data and tosaid second tester results of said testing in accordance with saidsecond test data.
 38. The test station of claim 33 further comprising aplurality of said electronic devices, wherein said testing meanscomprises: means for testing a first subset of said plurality ofelectronic devices in accordance with test data received from a firsttester of said plurality of testers; and means for testing a secondsubset of said plurality of electronic devices in accordance with testdata received from a second tester of said plurality of testers.
 39. Thetest station of claim 33 further comprising means for wirelesslytransmitting a request to said tester to configure the tester totransmit test data to said test station.
 40. The test station of claim33 further comprising means for wirelessly transmitting a request tosaid tester to configure the tester to stop transmitting test data tosaid test station.
 41. The test station of claim 33, wherein said probercomprises a test station and said electronic device comprises anunsingulated semiconductor wafer.
 42. The test station of claim 33,wherein said electronic device comprises a packaged semiconductor die.43. The test station of claim 33, wherein said electronic devicecomprises a singulated, unpackaged semiconductor die.
 44. The teststation of claim 33, wherein said electronic device comprises amulti-chip module.